International Symposium on Emotional Informatics

We are pleased to announce the upcoming International Symposium on Emotional Informatics, hosted by the Emotional Informatics Research Project.

Symposium Overview

  • Date: July 20 (Sat) – 21 (Sun), 2024
  • Venue: Fukutake Hall (Fukutake Learning Theater), The University of Tokyo
  • Format: Hybrid (In-person + Online)
  • Language: English
  • Registration Fee: Free

About the Symposium

This symposium will explore the emerging field of Emotional Informatics, which combines machine learning and neurophysiological research to understand human behavior through the lens of emotion. Recent advances in neuroimaging analysis have made it possible to estimate an individual’s emotional state from brain activity. This breakthrough promises to enhance our understanding of how emotions influence human behavior and decision-making across various disciplines, including psychology, linguistics, economics, and aesthetics.

Program Highlights

Day 1: Saturday, July 20, 2024

  • 13:00 – 13:05 Opening Remarks
  • 13:10 – 14:00 Junichi Chikazoe (ARAYA, Inc.)
  • 14:00 – 14:50 Adam K. Anderson (Cornell University)
  • 15:00 – 15:50 Tomohiro Ishizu (Kansai University)
  • 15:50 – 16:40 To Be Announced
  • 17:30 – 20:30 Networking Reception

Day 2: Sunday, July 21, 2024

  • 10:00 – 10:50 Eve DeRosa (Cornell University)
  • 10:50 – 11:40 To Be Announced
  • 13:00 – 13:50 Yasutora Watanabe (The University of Tokyo)
  • 13:50 – 14:40 Daichi Mochihashi (The Institute of Statistical Mathematics)
  • 15:00 – 16:00 Panel Discussion: “Beyond the Two-Dimensional Valence-Arousal Model”

Registration

To attend the symposium, please register through the following link

https://indigo784366.studio.site/participate

Contact Information

If you have any questions, please don’t hesitate to contact us: Email: info.jodojoho@gmail.com

Organizer

This symposium is organized by the Emotional Informatics Research Project, funded by KAKENHI Grant-in-Aid for Transformative Research Areas (B) (Project Number: 21H05059)